Location History:
- Tochigi-ken, JP (2016)
- Tochigi, JP (2017)
Company Filing History:
Years Active: 2016-2017
Title: Masaru Sasaki: Innovator in Solder Technology
Introduction
Masaru Sasaki is a prominent inventor based in Tochigi, Japan. He has made significant contributions to the field of solder technology, holding 2 patents that focus on enhancing the performance and reliability of electronic components.
Latest Patents
Sasaki's latest patents include innovations such as the Ni ball, Ni core ball, solder joint, solder paste, and solder foam. These inventions are designed to provide superior impact resistance to dropping, effectively inhibiting the occurrence of poor joints in electronic components. The construction of an electronic component involves joining a solder bump of a semiconductor chip to an electrode of a printed circuit board using solder paste. The solder bump is formed by connecting an electrode of the semiconductor chip to the Ni ball. The Ni ball boasts a purity of 99.9% to 99.995%, a sphericity of at least 0.90, and a Vickers hardness ranging from 20HV to 90HV. Additionally, he has developed an Ag ball, Ag core ball, flux-coated Ag ball, and other related products that aim to suppress soft errors and reduce connection faults.
Career Highlights
Masaru Sasaki is currently associated with Senju Metal Industry Co., Ltd., where he continues to innovate in the field of solder technology. His work has been instrumental in advancing the reliability of electronic components, making them more durable and efficient.
Collaborations
Sasaki has collaborated with notable coworkers such as Takashi Akagawa and Hiroyoshi Kawasaki, contributing to the development of cutting-edge solder technologies.
Conclusion
Masaru Sasaki's contributions to solder technology have significantly impacted the electronics industry, enhancing the durability and performance of electronic components. His innovative patents reflect his commitment to advancing technology in this critical field.