The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Feb. 03, 2015
Senju Metal Industry Co., Ltd., Tokyo, JP;
Takashi Akagawa, Tochigi-ken, JP;
Hiroyoshi Kawasaki, Tochigi-ken, JP;
Kazuhiko Matsui, Tochigi-ken, JP;
Yuichi Koikeda, Tochigi-ken, JP;
Masaru Sasaki, Tochigi-ken, JP;
Hiroyuki Yamasaki, Tochigi-ken, JP;
Takahiro Roppongi, Tochigi-ken, JP;
Daisuke Soma, Tochigi-ken, JP;
Isamu Sato, Saitama-ken, JP;
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Abstract
Providing an Ag ball having a low alpha dose and a high sphericity regardless of impurity elements having an amount equal to or more than a predetermined value except for Ag. In order to suppress a soft error and reduce an connection fault, a content of U is equal to or less than 5 ppb, a content of Th is equal to or less than 5 ppb, a purity is equal to or more than 99.9% but equal to or less than 99.9995%, an alpha dose is equal to or less than 0.0200 cph/cm, a content of either Pb or Bi or a total content of both Pb and Bi is equal to or more than 1 ppm, and a sphericity is equal to or more than 0.90.