Location History:
- Tochigi-ken, JP (2016)
- Tochigi, JP (2017)
Company Filing History:
Years Active: 2016-2017
Title: Yuichi Koikeda: Innovator in Solder Technology
Introduction
Yuichi Koikeda is a prominent inventor based in Tochigi, Japan. He has made significant contributions to the field of solder technology, particularly in the development of materials that enhance the reliability of electronic components. With a focus on improving impact resistance and reducing connection faults, Koikeda's innovations are vital for modern electronics.
Latest Patents
Koikeda holds 2 patents that showcase his expertise in solder materials. His latest patents include the Ni ball, Ni core ball, solder joint, solder paste, and solder foam. These inventions are designed to provide superior impact resistance to dropping, thereby inhibiting the occurrence of poor joints in electronic components. The Ni ball, for instance, is characterized by a purity of 99.9% to 99.995%, a sphericity of at least 0.90, and a Vickers hardness ranging from 20HV to 90HV. Additionally, he has developed Ag balls and related products that maintain low alpha doses and high sphericity, which are crucial for minimizing soft errors in electronic devices.
Career Highlights
Koikeda is currently employed at Senju Metal Industry Co., Ltd., where he continues to innovate in the field of solder technology. His work has significantly impacted the manufacturing processes of electronic components, ensuring higher reliability and performance.
Collaborations
Throughout his career, Koikeda has collaborated with notable colleagues, including Takashi Akagawa and Hiroyoshi Kawasaki. These partnerships have fostered a creative environment that encourages the development of cutting-edge solder materials.
Conclusion
Yuichi Koikeda's contributions to solder technology exemplify the importance of innovation in the electronics industry. His patents not only enhance the performance of electronic components but also pave the way for future advancements in the field.