Senju Metal Industry Co., Ltd.

Masaru Sasaki

Isamu Sato

Hiroyoshi Kawasaki

Takahiro Roppongi

Daisuke Soma

Takashi Akagawa

Yuichi Koikeda

Hiroyuki Yamasaki

Atsushi Ikeda

Kazuhiko Matsui

Provided are a Ni ball, a Ni core ball, a solder joint, solder paste and foamed solder which are superior in the impact resistance to dropping and can inhibit any occurrence of a poor joints. An electronic componentis constructed by joining a solder bumpof a semiconductor chipto an electrodeof a printed circuit boardwith solder paste. The solder bumpis formed by joining an electrodeof the semiconductor chipto the Ni ball. The Ni ballaccording to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.90, and Vickers hardness which is equal to or higher than 20HV and equal to or less than 90HV.

Ni ball, Ni core ball, solder joint, solder paste, and solder foam

Providing an Ag ball having a low alpha dose and a high sphericity regardless of impurity elements having an amount equal to or more than a predetermined value except for Ag. In order to suppress a soft error and reduce an connection fault, a content of U is equal to or less than 5 ppb, a content of Th is equal to or less than 5 ppb, a purity is equal to or more than 99.9% but equal to or less than 99.9995%, an alpha dose is equal to or less than 0.0200 cph/cm, a content of either Pb or Bi or a total content of both Pb and Bi is equal to or more than 1 ppm, and a sphericity is equal to or more than 0.90.

Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste

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Tochigi, Japan

Masaru Sasaki