The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2020
Filed:
May. 24, 2018
Senju Metal Industry Co., Ltd., Tokyo, JP;
Daisuke Maruko, Tochigi, JP;
Atsumi Takahashi, Tochigi, JP;
Hiroki Sudo, Tochigi, JP;
Hiroyoshi Kawasaki, Tokyo, JP;
Takahiro Hattori, Tochigi, JP;
Takahiro Roppongi, Tochigi, JP;
Daisuke Soma, Tochigi, JP;
Takashi Hagiwara, Tochigi, JP;
Isamu Sato, Saitama, JP;
Yuji Kawamata, Tochigi, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.