Tochigi, Japan

Hiroki Sudo

USPTO Granted Patents = 8 

 

Average Co-Inventor Count = 5.0

ph-index = 1


Location History:

  • Tochigi, JP (2020 - 2021)
  • Tokyo, JP (2022 - 2024)

Company Filing History:


Years Active: 2020-2025

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8 patents (USPTO):

Title: Hiroki Sudo: Innovator in Solder Technology

Introduction

Hiroki Sudo is a prominent inventor based in Tochigi, Japan, known for his significant contributions to solder technology. With a total of eight patents to his name, Sudo has made remarkable advancements in lead-free and antimony-free solder alloys, which are crucial for modern electronics.

Latest Patents

Sudo's latest patents include a lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint. This innovative solder alloy features a medium-low melting point and maintains solderability even after prolonged exposure to high temperatures. The alloy composition consists of 12 to 23% by mass of indium (In) and 0.001 to 0.08% by mass of germanium (Ge), with the balance being tin (Sn) and unavoidable impurities. Additionally, Sudo has developed another solder alloy that boasts a low melting point, high hardness in high-temperature environments, heat cycle resistance, and electromigration resistance. This alloy includes 30 to 60% bismuth (Bi), 0.7 to 2.0% silver (Ag), and other components, ensuring its effectiveness in various applications.

Career Highlights

Hiroki Sudo is currently employed at Senju Metal Industry Co., Ltd., where he continues to innovate in the field of solder technology. His work has significantly impacted the electronics industry, providing solutions that enhance the reliability and performance of electronic components.

Collaborations

Sudo collaborates with notable colleagues, including Hiroyoshi Kawasaki and Takahiro Roppongi, to further advance solder technology and develop new applications for their inventions.

Conclusion

Hiroki Sudo's contributions to solder technology through his innovative patents have established him as a key figure in the field. His work not only addresses current industry challenges but also paves the way for future advancements in electronics.

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