The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Jun. 10, 2019
Senju Metal Industry Co., Ltd., Tokyo, JP;
Hiroyoshi Kawasaki, Tokyo, JP;
Shigeki Kondoh, Tochigi, JP;
Hiroki Sudo, Tochigi, JP;
Masato Tsuchiya, Tochigi, JP;
Takashi Yashima, Tochigi, JP;
Takahiro Roppongi, Tochigi, JP;
Daisuke Soma, Tochigi, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
The Cu core ball contains a Cu ball and one or more metal layer for covering a surface of the Cu ball, each layer including one or more element selected from Ni, Co, Fe and Pd. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% by mass or higher and 99.9995% or lower, sphericity which is 0.95 or higher and a diameter of 1 μm or more to 1000 μm or lower.