Shigeki Kondoh

Title: Shigeki Kondoh: Innovator in Electronic Components

Introduction

Shigeki Kondoh is a prominent inventor based in Tochigi, Japan. He has made significant contributions to the field of electronic components, holding a total of four patents. His work focuses on innovative materials and methods that enhance the performance and reliability of electronic devices.

Latest Patents

Kondoh's latest patents include advancements in core materials and methods for forming bump electrodes. One of his notable inventions involves a core material that features a core surrounded by a solder layer made from a (Sn—Bi)-based solder alloy. This design includes a Sn layer on the outer side of the solder layer. The core can be composed of metal or resin, and the concentration ratio of Bi in the solder layer is carefully controlled to range from 91.4% to 106.7%. Additionally, the thickness of the Sn layer is specified to be between 0.215% and 36% of the solder layer's thickness. Another patent details a core material with a solder layer that contains Sn and various other elements, ensuring a thickness of at least 1 μm on one side, with the Sn layer also having a minimum thickness of 0.1 μm.

Career Highlights

Shigeki Kondoh is currently employed at Senju Metal Industry Co., Ltd., where he continues to innovate in the field of electronic components. His work has been instrumental in developing materials that improve the efficiency and functionality of electronic devices.

Collaborations

Kondoh collaborates with talented coworkers, including Masato Tsuchiya and Hiroki Sudo. Their combined expertise contributes to the advancement of technology in their field.

Conclusion

Shigeki Kondoh's contributions to electronic components through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of advanced materials and methods in electronics.