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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11495566 B1

PDFFull Text
Date of Patent:
Nov. 08, 2022

Filed:

Sep. 10, 2021

Core material, electronic component and method for forming bump electrode

Applicant:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Inventors:

Shigeki Kondoh, Tokyo, JP;

Masato Tsuchiya, Tokyo, JP;

Hiroyuki Iwamoto, Tokyo, JP;

Hiroshi Okada, Tokyo, JP;

Daisuke Souma, Tokyo, JP;

Assignee:

SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

William A Harriston

Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 24/11 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13582 (2013.01); H01L 2224/13583 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/13657 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/0133 (2013.01);
Abstract

A core material has a core; a solder layer provided outside the core and being a solder alloy containing Sn and at least any one element of Ag, Cu, Sb, Ni, Co, Ge, Ga, Fe, Al, In, Cd, Zn, Pb, Au, P, S, Si, Ti, Mg, Pd, and Pt; and a Sn layer provided outside the solder layer. The solder layer has a thickness of 1 μm or more on one side. The Sn layer has a thickness of 0.1 μm or more on one side. A thickness of the Sn layer is 0.215% or more and 36% or less of the thickness of the solder layer.

Find Patent Forward Citations

Kondoh, Shigeki. (2022). Core material, electronic component and method for forming bump electrode (U.S. Patent No. 11495566). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11495566

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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