This inventor holds 8 USPTO granted patents and 2 published patent applications and 1 EPO patent. Top assignees: Nec Corporation, Juniper Networks, Inc., Senju Metal Industry Co., Ltd.. Active years: 1996-2026.
Company Filing History:
4 out of 36,676 
2 out of 4,776 
1 out of 338 Years Active: 1996-2026
Title: Hiroyuki Iwamoto: Innovator in Electronic Components
Introduction
Hiroyuki Iwamoto is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of electronic components, holding a total of 8 patents. His innovative work has advanced technology in various applications, particularly in core materials and ATM switches.
Latest Patents
Iwamoto's latest patents include a core material, electronic component, and method for forming a bump electrode. This core material features a core surrounded by a solder layer, which is a solder alloy containing tin and various other elements. The solder layer has a thickness of 1 µm or more on one side, while the tin layer has a thickness of 0.1 µm or more. Additionally, he has developed a switch with OAM functions, which simplifies OAM processing on the incoming line side. This innovation includes a header conversion table and an OAM table that manage the flow of OAM cells effectively.
Career Highlights
Throughout his career, Hiroyuki Iwamoto has worked with notable companies such as NEC Corporation and Juniper Networks, Inc. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in the electronic component sector.
Collaborations
Iwamoto has collaborated with esteemed colleagues, including Shigeki Kondoh and Masato Tsuchiya. These partnerships have fostered a creative environment that has led to the development of innovative solutions in their respective fields.
Conclusion
Hiroyuki Iwamoto's contributions to electronic components and his impressive portfolio of patents highlight his role as a leading inventor in the industry. His work continues to influence advancements in technology and electronic applications.