Masato Tsuchiya

Title: The Innovations of Masato Tsuchiya

Introduction

Masato Tsuchiya is a prominent inventor based in Tochigi, Japan. He has made significant contributions to the field of materials science and semiconductor technology. With a total of six patents to his name, Tsuchiya's work has had a considerable impact on the industry.

Latest Patents

Among his latest patents are several innovative technologies. One of his notable inventions is a layered bonding material that includes a base material, a first solder section stacked on a first surface of the base material, and a second solder section stacked on a second surface of the base material. The coefficient of linear expansion of the base material is between 5.5 to 15.5 ppm/K, and both solder sections are made of lead-free solder with thicknesses ranging from 0.05 to 1.0 mm. Another significant patent is related to a core material, electronic component, and method for forming a bump electrode. This invention features a core with a solder layer made of a (Sn—Bi)-based solder alloy and a Sn layer on the outer side of the solder layer. The concentration ratio of Bi in the solder layer is maintained between 91.4% to 106.7% of the target Bi content.

Career Highlights

Masato Tsuchiya is currently employed at Senju Metal Industry Co., Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of semiconductor packaging and bonding materials.

Collaborations

Throughout his career, Tsuchiya has collaborated with notable colleagues, including Shigeki Kondoh and Hiroki Sudo. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Masato Tsuchiya's contributions to the field of materials science and semiconductor technology are noteworthy. His innovative patents and collaborations highlight his commitment to advancing technology in his industry.