The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2023
Filed:
Mar. 19, 2021
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Naoto Kameda, Tokyo, JP;
Masato Tsuchiya, Tokyo, JP;
Katsuji Nakamura, Tokyo, JP;
Osamu Munekata, Tokyo, JP;
Kaichi Tsuruta, Tokyo, JP;
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/02 (2006.01); B23K 35/26 (2006.01); B32B 15/01 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0238 (2013.01); B23K 35/262 (2013.01); B32B 15/01 (2013.01); H01L 23/3672 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); B23K 2101/40 (2018.08); B32B 2307/732 (2013.01); H01L 2224/2908 (2013.01); H01L 2224/2918 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29184 (2013.01); H01L 2224/32225 (2013.01);
Abstract
In a layered bonding material, a coefficient of linear expansion of a base materialis 5.5 to 15.5 ppm/K and a first surface and a second surface of the base materialare coated with pieces of lead-free solderand