Souka, Japan

Osamu Munekata



Average Co-Inventor Count = 4.4

ph-index = 4

Forward Citations = 51(Granted Patents)


Location History:

  • Koshigaya, JP (2000 - 2003)
  • Souka, JP (2006 - 2010)
  • Tochigi, JP (2012 - 2020)
  • Tokyo, JP (2022 - 2023)

Company Filing History:


Years Active: 2000-2023

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11 patents (USPTO):Explore Patents

Title: Osamu Munekata: Innovator in Semiconductor Technology

Introduction

Osamu Munekata is a prominent inventor based in Souka, Japan, known for his significant contributions to semiconductor technology. With a total of 11 patents to his name, Munekata has made remarkable advancements in materials used for electronic components.

Latest Patents

His latest patents include innovations such as a layered bonding material, a semiconductor package, and a power module. The layered bonding material features a coefficient of linear expansion of a base material ranging from 5.5 to 15.5 ppm/K, with both surfaces coated with lead-free solder. Additionally, his solder alloy is designed to suppress changes in solder paste over time, reduce temperature differences between liquidus and solidus temperatures, and ensure high reliability. The alloy composition includes specific percentages of arsenic, antimony, bismuth, and lead, adhering to strict formulas for optimal performance.

Career Highlights

Throughout his career, Munekata has worked with notable companies such as Senju Metal Industry Co., Ltd. and Matsushita Electric Industrial Co., Ltd. His work has significantly impacted the development of reliable electronic components, enhancing the performance and longevity of semiconductor devices.

Collaborations

Munekata has collaborated with esteemed colleagues, including Yoshitaka Toyoda and Minoru Ueshima, contributing to various projects that have advanced the field of semiconductor technology.

Conclusion

Osamu Munekata's innovative work in semiconductor materials and his numerous patents highlight his role as a key figure in the industry. His contributions continue to influence the development of reliable electronic components, showcasing the importance of innovation in technology.

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