The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2000
Filed:
Nov. 14, 1997
Applicant:
Inventors:
Toshihiko Taguchi, Kitakatsushika-gun, JP;
Rikiya Katoh, Soka, JP;
Osamu Munekata, Koshigaya, JP;
Yoshitaka Toyoda, Satte, JP;
Assignee:
Senju Metal Industry, Co., Ltd., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ;
U.S. Cl.
CPC ...
2282481 ; 22818022 ;
Abstract
A solder paste suitable for use in reflow soldering of chip components having good soldering properties without causing tombstoning comprises a solder powder admixed with a viscous flux. The solder powder is comprised of a twin peak solder alloy consisting essentially, on a weight basis, of: 60-65% Sn, 0.1-0.6% Ag, 0.1-2% Sb, and a balance of Pb, and having a liquidus temperature below 200.degree. C.