Rikiya Katoh

Title: Rikiya Katoh: Innovator in Lead-Free Solder Technology

Introduction

Rikiya Katoh is a notable inventor based in Sohka, Japan. He has made significant contributions to the field of solder technology, particularly focusing on lead-free solutions. With a total of 4 patents to his name, Katoh's work is pivotal in advancing electronic device manufacturing.

Latest Patents

Among his latest innovations, Katoh developed a lead-free solder paste that is suitable for soldering chip parts. This solder paste includes a powder of a twin-peak Sn-based solder alloy containing 0.2-1.0 mass % of Ag and a flux. The solder alloy exhibits a first peak of heat absorption in a differential scanning calorimeter curve at the start of melting, followed by a second peak when the major portion of the alloy subsequently melts. Additionally, he created a lead-free solder alloy characterized by a relatively low melting temperature, which is ideal for soldering electronic devices. This alloy consists of 5 to 9 mass % of Zn, 2 to 15 mass % of Bi, and may optionally include 0.001 to 1 mass % of P or 0.001 to 0.1 mass % of Ge, with the balance being Sn. The liquidus temperature of this solder alloy is at most 220°C.

Career Highlights

Rikiya Katoh has worked with prominent companies in the industry, including Senju Metal Industry Co., Ltd. and Kabushiki Kaisha Toshiba. His experience in these organizations has allowed him to refine his expertise in solder technology and contribute to innovative solutions in the field.

Collaborations

Throughout his career, Katoh has collaborated with notable professionals such as Yoshitaka Toyoda and Osamu Munekata. These partnerships have further enhanced his work and impact in the industry.

Conclusion

Rikiya Katoh's contributions to lead-free solder technology demonstrate his commitment to innovation and excellence. His patents reflect a significant advancement in the field, promoting safer and more efficient manufacturing processes for electronic devices.