The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2009
Filed:
Jan. 08, 2003
Masayuki Ojima, Tochigi, JP;
Haruo Suzuki, Tochigi, JP;
Hirofumi Nogami, Ibaraki, JP;
Norihisa Eguchi, Takatsuki, JP;
Osamu Munekata, Souka, JP;
Minoru Ueshima, Matsudo, JP;
Masayuki Ojima, Tochigi, JP;
Haruo Suzuki, Tochigi, JP;
Hirofumi Nogami, Ibaraki, JP;
Norihisa Eguchi, Takatsuki, JP;
Osamu Munekata, Souka, JP;
Minoru Ueshima, Matsudo, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Matushita Electric Industrial Co., Ltd., Kadoma, JP;
Abstract
The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then replenished during soldering so as to maintain the surface level of molten solder in the bath with a replenishment solder alloy which supplies the oxidation suppressing element to the solder bath at at least the rate at which the oxidation suppressing element is consumed during soldering. When the oxidation suppressing element is P, the concentration of P in the replenishment solder alloy is preferably 60-100 ppm.