The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2006
Filed:
Jul. 08, 2003
Masazumi Amagai, Tsukuba, JP;
Masako Watanabe, Oita, JP;
Kensho Murata, Beppu, JP;
Osamu Munekata, Souka, JP;
Yoshitaka Toyoda, Satte, JP;
Minoru Ueshima, Misato, JP;
Tsukasa Ohnishi, Souka, JP;
Hiroshi Okada, Souka, JP;
Masazumi Amagai, Tsukuba, JP;
Masako Watanabe, Oita, JP;
Kensho Murata, Beppu, JP;
Osamu Munekata, Souka, JP;
Yoshitaka Toyoda, Satte, JP;
Minoru Ueshima, Misato, JP;
Tsukasa Ohnishi, Souka, JP;
Hiroshi Okada, Souka, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
A lead-free solder alloy comprises 1.0–5.0 wt % Ag, 0.01–0.5 wt % Ni, one or both of (a) 0.001–0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001–0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high bonding strength and which do not undergo yellowing after soldering.