Tokyo, Japan

Hiroshi Okada

This inventor holds 83 USPTO granted patents and 7 published patent applications, plus 5 CIPO patents and 9 EPO patents, primarily in Solder Materials (CPC class 360 191). Top assignees: Sony Corporation, Senju Metal Industry Co., Ltd., Mitsubishi Rayon Company, Limited. Active years: 1985-2025.

USPTO Granted Patents = 83 

% Patents Active = 74.7


 

Average Co-Inventor Count = 2.9

ph-index = 14

Forward Citations = 605(Granted Patents)

Forward Citations (Not Self Cited) = 596(Dec 10, 2025)


Inventors with similar research interests:


    Location History:

    • Sagamihara, JP (1985)
    • Tokyo-To, JP (2006)
    • Souka, JP (2006 - 2008)
    • Mooka, JP (2010)
    • Setagaya-ku, JP (2009 - 2012)
    • Nirasaki, JP (2012 - 2013)
    • Moka, JP (2014)
    • Miyagi, JP (2013 - 2016)
    • Yokohama, JP (1996 - 2020)
    • Shanghai, CN (2020)
    • Kanagawa, JP (1985 - 2023)
    • Tokyo, JP (1987 - 2024)

    Company Filing History:

    goldMedal29 out of 58,144 
     
    Sony Corporation
     patents
    silverMedal12 out of 338 
     
    Senju Metal Industry Co., Ltd.
     patents
    bronzeMedal7 out of 1,357 
     
    Mitsubishi Rayon Company, Limited
     patents
    45 out of 6,899 
     
    Kyocera Corporation
     patents
    55 out of 2,643 
     
    The Furukawa Electric Co., Ltd.
     patents
    64 out of 2,874 
     
    Hitachi-High-Technologies Corporation
     patents
    73 out of 817 
     
    Mitsui Minings & Melting Co., Ltd.
     patents
    82 out of 2,208 
     
    Fuji Jukogyo Kabushiki Kaisha
     patents
    92 out of 13,420 
     
    Nissan Motor Company Limited
     patents
    102 out of 4,980 
     
    Oki Electric Industry Co., Ltd.
     patents
    111 out of 129 
     
    Bandai Co., Ltd.
     patents
    121 out of 53 
     
    Freund Industrial Co., Ltd.
     patents
    131 out of 1,867 
     
    Fujikura Limited
     patents
    141 out of 1 
     
    Mitsui Mining and Smelting Co., Ltd. (Nirasaki Factory)
     patent
    151 out of 242 
     
    Ohi Seisakusho Co., Ltd.
     patents
    161 out of 1,875 
     
    Oki Data Corporation
     patents
    171 out of 2,335 
     
    Sony Electronics Inc
     patents
    181 out of 10,837 
     
    Tokyo Electron Limited
     patents
    195 out of 834,307 
    Other
     patents
    where one patent can have more than one assignee

    Years Active: 1985-2025

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    Areas of Expertise:
    Vapor Chamber
    Solder Alloy
    Imaging Apparatus
    Heat Transfer Device
    Core Material
    Bump Electrode
    Mobile Object
    Illumination Apparatus
    Camera Module
    Lead-Free Solder
    Pattern Transfer
    Electronic Component
    83 patents (USPTO):Explore Patents

    Title: Hiroshi Okada: A Trailblazer in Innovative Patents

    Introduction

    Hiroshi Okada, an esteemed inventor based in Tokyo, Japan, has made significant contributions to the world of technology with an impressive portfolio of 81 patents. His work focuses on advancements in thermal management solutions and electronic components, showcasing his commitment to innovation.

    Latest Patents

    Among Hiroshi Okada's latest inventions is the vapor chamber with a multilayer wick. This vapor chamber consists of a container with a hollow cavity formed by two plate-shaped members layered together. It encloses a working fluid and features a wick structure that includes a first wick part and a second wick part, each designed with specific dimensions to optimize performance.

    Another notable patent is for a core material that incorporates a solder layer made from a (Sn—Bi)-based solder alloy. This core material includes a core surrounded by a solder layer and a Sn layer, with precise concentration ratios of Bi for enhanced functionality. These innovations reflect Okada's expertise in enhancing electronic component efficiency.

    Career Highlights

    Hiroshi Okada has had a remarkable career, including positions at renowned companies such as Sony Corporation and Senju Metal Industry Co., Ltd. His time at these organizations has not only expanded his skill set but also allowed him to contribute to significant technological breakthroughs.

    Collaborations

    Throughout his career, Okada has collaborated with talented individuals, including notable coworkers Takao Takahashi and Yoichiro Sako. Their combined expertise and creativity have led to pioneering advancements in the field, further highlighting Okada's influence in technology.

    Conclusion

    Hiroshi Okada stands out as a leading innovator with a wealth of patents that demonstrate his remarkable engineering capabilities. His contributions continue to pave the way for advancements in thermal management and electronic components, solidifying his reputation in the realm of innovation.

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