The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2022
Filed:
Nov. 21, 2018
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Hiroyoshi Kawasaki, Tokyo, JP;
Hiroki Sudo, Tokyo, JP;
Takahiro Roppongi, Tokyo, JP;
Hiroshi Okada, Tokyo, JP;
Daisuke Soma, Tokyo, JP;
Takashi Akagawa, Tokyo, JP;
Hiroshi Takahashi, Tokyo, JP;
Hiroshi Kawanago, Tokyo, JP;
Satoshi Yokota, Tokyo, JP;
Osamu Munekata, Tokyo, JP;
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); B23K 35/02 (2006.01); C22C 13/00 (2006.01); C22C 13/02 (2006.01); B22F 1/00 (2022.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/025 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H05K 3/3457 (2013.01); Y10T 428/12708 (2015.01);
Abstract
The present invention provides a solder material containing Sn or a Sn-containing alloy and 40 to 320 ppm by mass of A, the solder material including an As-enriched layer.