The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2024
Filed:
Sep. 30, 2020
Senju Metal Industry Co., Ltd., Tokyo, JP;
Shigeki Kondoh, Tokyo, JP;
Masato Tsuchiya, Tokyo, JP;
Hiroki Sudo, Tokyo, JP;
Hiroshi Okada, Tokyo, JP;
Daisuke Souma, Tokyo, JP;
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Abstract
A core material has a core; a solder layermade of a (Sn—Bi)-based solder alloy provided on an outer side of the core; and a Sn layerprovided on an outer side of the solder layer. The core contains metal or a resin. When a concentration ratio of Bi contained in the solder layeris a concentration ratio (%)=a measured value of Bi (% by mass)/a target Bi content (% by mass), or a concentration ratio (%)=an average value of measured values of Bi (% by mass)/a target Bi content (% by mass), the concentration ratio is 91.4% to 106.7%. The thickness of the Sn layeris 0.215% or more and 36% or less of the thickness of the solder layer