Tokyo, Japan

Daisuke Souma

USPTO Granted Patents = 6 

 

Average Co-Inventor Count = 4.5

ph-index = 3

Forward Citations = 28(Granted Patents)


Location History:

  • Tochigi, JP (2007 - 2010)
  • Tokyo, JP (2013 - 2024)

Company Filing History:


Years Active: 2007-2024

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6 patents (USPTO):

Title: Daisuke Souma: Innovator in Electronic Components

Introduction

Daisuke Souma is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of electronic components, holding a total of six patents. His innovative work focuses on core materials and methods for forming bump electrodes, which are essential in modern electronic devices.

Latest Patents

Daisuke's latest patents include a core material and an electronic component that features a unique method for forming bump electrodes. One of his notable inventions describes a core material that consists of a core, a solder layer made from a (Sn—Bi)-based solder alloy, and a Sn layer on the outer side of the solder layer. The core can be made of metal or resin, and the concentration ratio of Bi in the solder layer is carefully controlled to be between 91.4% and 106.7%. Additionally, the thickness of the Sn layer is specified to be between 0.215% and 36% of the solder layer's thickness. Another patent outlines a similar core material with a solder layer that contains various elements, ensuring high performance and reliability in electronic applications.

Career Highlights

Daisuke Souma is currently employed at Senju Metal Industry Co., Ltd., where he continues to develop innovative solutions in the electronics sector. His work has been instrumental in advancing the technology used in electronic components, making them more efficient and reliable.

Collaborations

Daisuke has collaborated with notable colleagues, including Hiroshi Okada and Takahiro Roppongi. Their combined expertise has contributed to the successful development of various projects and patents in the field of electronic components.

Conclusion

Daisuke Souma is a key figure in the innovation of electronic components, with a strong portfolio of patents that reflect his expertise and dedication to advancing technology. His contributions continue to impact the industry positively.

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