Sony Corporation

Senju Metal Industry Co., Ltd.

Mitsubishi Rayon Company, Limited

Other

Kyocera Corporation

Hitachi-high-technologies Corporation

The Furukawa Electric Co., Ltd.

Mitsui Mining & Smelting Company, Ltd.

Nissan Motor Company Limited

Oki Electric Industry Co., Ltd.

Fuji Jukogyo Kabushiki Kaisha

Tokyo Electron Limited

Sony Electronics Inc

Oki Data Corporation

Fujikura Limited

Hiroshi Okada

Takao Takahashi

Yoichiro Sako

Kazuyuki Sakoda

Kohei Asada

Kazuhiro Watanabe

Shingo Suzuki

Kenji Nakano

Yoshihiro Yamashita

Takahiro Roppongi

Hirofumi Yuchi

Nobuo Ito

Kenya Wada

Hideaki Kataho

Nao Mizumoto

Masatoshi Toda

Hajime Inoue

Naofumi Yanagihara

Daisuke Soma

Tatsuro Miura

Hiroki Sudo

Masanobu Ohtsu

Takashi Sato

Masaaki Yamamoto

Kiyoshi Yoneda

Hiroyoshi Kawasaki

Shigeru Tajima

Takashi Sawada

Minoru Ueshima

Yoshikatsu Inagaki

Masazumi Amagai

Yoshitaka Toyoda

Takaaki Yamada

Shinichi Nomoto

Tsukasa Ohnishi

Yutaka Fukuyama

Yasumi Sasaki

Kouji Miyata

Takahiro Hattori

Osamu Munekata

Masako Watanabe

Kensho Murata

Masato Tsuchiya

Takatoshi Nakamura

Akira Tange

Hisato Shima

Mitsuru Takehara

Hiroshi Takahashi

Hiroshi Kikuchi

Yoshihiro Yoneda

Keiji Kanota

Takashi Saito

Hirofumi Aoki

Takayasu Kon

Hiroyuki Hanaya

Tadashi Kasai

Isamu Sato

Masahiko Enari

Akira Nagumo

Yukio Kubota

Yasunori Kamada

Kazunori Hayashi

Masaki Oguro

Jiro Tanuma

Tomoya Onuma

Masahiro Sueyoshi

Naoki Miyabayashi

Noboru Murabayashi

Yuki Koga

Yasuhiko Kasama

Katsuyuki Ito

Satoshi Takahashi

Akihiro Kikuchi

Koji Nagaoka

Shuichi Ota

Shunsaku Yoshikawa

Hiroshi Yoshioka

Takao Kondo

Shinichi Katakura

Yuji Ito

Kenji Omote

Takatoshi Nakata

Satoshi Yokota

Koji Iijima

Hiroshi Kawanago

Ryoichi Kurata

Junichi Yokota

Kazuhiko Nagaoka

Nobuo Wakasugi

Masao Mizutani

Yoshiki Igarashi

Shin Hirotsu

Rikiya Kato

Yuriko Kishitaka

Nagayoshi Myo

Makoto Suzuki

Takashi Akagawa

Hiroyuki Iwamoto

Kiyoshi Ichimura

Kanta Dei

Provided are a solder alloy, a solder ball, and a solder joint which have an excellent pin contact performance and a high bonding strength. The solder alloy has an alloy composition consisting of, by mass %, Ag: 0.8 to 1.5%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.10%, and P: 0.006% to 0.009%, with the balance being Sn. The alloy composition preferably satisfies the following relations (1) and (2): 2.0≤Ag×Cu×Ni/P≤25, 0.500≤Sn×P≤0.778. Ag, Cu, Ni, P, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.

Solder alloy, solder ball, and solder joint

The vapor chamber includes a container having a hollow cavity and formed of one plate-shaped member and another plate-shaped member facing the one plate-shaped member that are layered on each other, a working fluid enclosed in the cavity, and a wick structure provided in the cavity. The wick structure includes a first wick part extending from a heat receiving part to a heat discharge part and having a first wick member using a linear member, and a second wick part provided to the heat receiving part and having a second wick member using a linear member. An average diameter the linear member of the second wick member is smaller than an average diameter of the linear member of the first wick member or an aperture dimension of the second wick member is smaller than an aperture dimension of the first wick member.

Vapor chamber with multilayer wick

A core material has a core; a solder layermade of a (Sn—Bi)-based solder alloy provided on an outer side of the core; and a Sn layerprovided on an outer side of the solder layer. The core contains metal or a resin. When a concentration ratio of Bi contained in the solder layeris a concentration ratio (%)=a measured value of Bi (% by mass)/a target Bi content (% by mass), or a concentration ratio (%)=an average value of measured values of Bi (% by mass)/a target Bi content (% by mass), the concentration ratio is 91.4% to 106.7%. The thickness of the Sn layeris 0.215% or more and 36% or less of the thickness of the solder layer

Core material, electronic component and method for forming bump electrode

[Object] To provide a recording device capable of acquiring information on behavior of a moving body with high accuracy by using a simple configuration. [Solution] Provided is the recording device including: a sensing unit configured to output data obtained through sensing; a reception unit configured to receive a wireless signal from a signal transmission device provided in a moving body; a recording control unit configured to control start and stop of recording of the data output from the sensing unit, in response to the wireless signal received by the reception unit from the signal transmission device; and a transmission unit configured to transmit the data recorded under the control of the recoding control unit, to an external device.

Recording device, recording method, and computer program

A core material has a core; a solder layer provided outside the core and being a solder alloy containing Sn and at least any one element of Ag, Cu, Sb, Ni, Co, Ge, Ga, Fe, Al, In, Cd, Zn, Pb, Au, P, S, Si, Ti, Mg, Pd, and Pt; and a Sn layer provided outside the solder layer. The solder layer has a thickness of 1 &#x3bc;m or more on one side. The Sn layer has a thickness of 0.1 &#x3bc;m or more on one side. A thickness of the Sn layer is 0.215% or more and 36% or less of the thickness of the solder layer.

A method includes applying a first flux onto an electrode provided on a substrate and placing a solder material on the electrode, heating the substrate to form a solder bump on the electrode, deforming the solder bump to provide a flat surface or a depressed portion on the solder bump, applying a second flux to the solder bump; placing a core material on the solder bump, the core material including a core portion and a solder layer that covers a surface of the core portion, and heating the substrate to join the core material to the electrode by the solder bump and the solder layer.

Method for forming bump electrode substrate

There is provided a mobile object including an imaging unit configured to capture a perimeter of the mobile object, a speaker configured to be capable of controlling directivity, a determination unit configured to determine whether the mobile object is in a driving mode, and a speaker control unit configured to control the speaker in the driving mode in a manner that predetermined audio is output toward a warning target that is recognized based on a captured image captured by the imaging unit, and to control the speaker in a non-driving mode in a manner that the predetermined audio is output in a non-directional way.

Mobile object and storage medium

The present invention provides a solder material containing Sn or a Sn-containing alloy and 40 to 320 ppm by mass of A, the solder material including an As-enriched layer.

Solder material, solder paste, and solder joint

To provide a recording device capable of acquiring information on behavior of a moving body with high accuracy by using a simple configuration. Provided is the recording device including: a sensing unit configured to output data obtained through sensing; a reception unit configured to receive a wireless signal from a signal transmission device provided in a moving body; a recording control unit configured to control start and stop of recording of the data output from the sensing unit, in response to the wireless signal received by the reception unit from the signal transmission device; and a transmission unit configured to transmit the data recorded under the control of the recoding control unit, to an external device.

Recording device and recording method

Provided is an imaging apparatus () including an imaging optical system (), an image sensor (), one or more circuit boards including at least one of the image sensor and an electronic component mounted thereon, a housing () including an opening that exposes the imaging optical system to a subject and supporting the imaging optical system, the image sensor, and the one or more circuit boards, a signal terminals () that transmit an image signal of the subject image captured by the image sensor to an outside of the housing, and a heat transfer unit () having heat conductivity connected to the plurality of terminals, the heat transfer unit that transfers heat generated from at least one of the image sensor and the electronic component to the plurality of terminals.

Imaging apparatus and vehicle

Provided is a solder material having oxidation resistance at the time of melting solder or after melting it, as well as managing a thickness of oxide film at a fixed value or less before melting the solder. A Cu core ballA is provided with a Cu ballA for keeping a space between a semiconductor package and a printed circuit board and a solder layerA that covers the Cu ballA. The solder layerA is composed of Sn or a solder alloy whose main component is Sn. For the Cu core ballA, lightness is equal to or more than 65 in the L*a*b* color space and yellowness is equal to or less than 7.0 in the L*a*b* color space, and more preferably, the lightness is equal to or more than 70 and the yellowness thereof is equal to or less than 5.1.

Solder material, solder paste, solder preform, solder joint and method of managing the solder material

A lens includes a lens body comprising a cylindrical surface along an optical axis direction and a fixed portion radially outwardly protruding from the lens body, comprising a diameter diminishing more and more from an image side toward a subject side along an optical axis of the lens body, and including an inclined surface contiguous to the cylindrical surface of the lens body.

Lens, lens unit, and imaging apparatus

A heat transfer device includes a heat pipe in which working fluid is enclosed, a heat receiving plate provided on one end side of the heat pipe and a heat radiating fin provided on the other end side of the heat pipe, a first wick and a second wick that transfer working fluid provided on an inner wall surface of the heat pipe, a bent section bent between the one end side and the other end side, and a boundary section between the first wick and the second wick disposed in a lower part in the gravity direction of the bent section of the heat pipe or the heat transfer device. The heat transfer device can improve heat transfer characteristics with a simple configuration.

Heat transfer device

The invention provides a flattened heat pipe whose vapor flowing passage is not clogged and which has an excellent capillary force. The flattened heat pipe has a closed container formed by flattening a tubular container, a plurality of wick structures arrayed within the container in a longitudinal direction so as to form an acute-angled portion where a capillary force is large at least partially within the container, a hollow portion formed of an outer peripheral surface of the wick structure and an inner wall surface of the container and a working fluid sealed into the container.

Flattened heat pipe and manufacturing method thereof

Growing community of inventors

Tokyo, Japan

Hiroshi Okada