The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Apr. 18, 2022
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 1/00 (2006.01); B23K 101/40 (2006.01); B23K 103/12 (2006.01); B23K 103/16 (2006.01); B32B 15/01 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); B23K 1/0016 (2013.01); B32B 15/01 (2013.01); H01L 24/32 (2013.01); B23K 2101/40 (2018.08); B23K 2103/12 (2018.08); B23K 2103/166 (2018.08); H01L 2224/29083 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/2918 (2013.01); H01L 2224/29184 (2013.01); H01L 2224/32225 (2013.01);
Abstract
A layered bonding materialincludes a base material, a first solder sectionstacked on a first surface of the base material, and a second solder sectionstacked on a second surface of the base material. A coefficient of linear expansion of the base materialis 5.5 to 15.5 ppm/K, the first solder sectionand the second solder sectionare made of lead-free solder, and both of a thickness of the first solder sectionand a thickness of the second solder sectionare 0.05 to 1.0 mm.