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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10675719 B1

PDFFull Text
Date of Patent:
Jun. 09, 2020

Filed:

Dec. 24, 2015

Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint

Applicant:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Inventors:

Hiroyoshi Kawasaki, Tokyo, JP;

Shigeki Kondo, Tochigi, JP;

Atsushi Ikeda, Tochigi, JP;

Takahiro Roppongi, Tochigi, JP;

Takashi Hagiwara, Tochigi, JP;

Daisuke Soma, Tochigi, JP;

Kaichi Tsuruta, Tochigi, JP;

Isamu Sato, Saitama, JP;

Yuji Kawamata, Tochigi, JP;

Assignee:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Attorney:

The Webb Law Firm

Primary Examiner:

Erin B Saad

Int. Cl.
CPC ...
B23K 35/00 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); C25D 3/60 (2006.01); B23K 35/22 (2006.01); B23K 35/02 (2006.01); B23K 1/00 (2006.01); C25D 3/56 (2006.01); C22C 9/00 (2006.01); C25D 3/32 (2006.01); B23K 3/06 (2006.01); C25D 3/18 (2006.01); C25D 7/00 (2006.01); B22F 1/02 (2006.01); B22F 9/08 (2006.01); B23K 35/30 (2006.01); C23C 18/32 (2006.01); C25D 5/10 (2006.01); C25D 5/12 (2006.01); C25D 5/18 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B22F 1/025 (2013.01); B22F 9/08 (2013.01); B23K 1/00 (2013.01); B23K 3/06 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/22 (2013.01); B23K 35/3033 (2013.01); C22C 9/00 (2013.01); C22C 13/00 (2013.01); C23C 18/32 (2013.01); C25D 3/18 (2013.01); C25D 3/32 (2013.01); C25D 3/562 (2013.01); C25D 3/60 (2013.01); C25D 7/00 (2013.01); B22F 2301/10 (2013.01); B22F 2301/15 (2013.01); C25D 5/10 (2013.01); C25D 5/12 (2013.01); C25D 5/18 (2013.01);
Abstract

Provided herein is a solder material that includes a spherical core that provides space between a joint object and another object to be joined to the joint object and a solder coated layer that has a melting point at which a core layer of the core is not melted. The solder coated layer includes Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core. The solder coated layer has an average grain diameter of crystal grains of 3 μm or less, and the solder material has a spherical diameter of 1 to 230 μm and a sphericity of 0.95 or more.

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