Location History:
- Hyogo, JP (1989 - 1990)
- Himeji, JP (1994 - 1997)
- Tokyo, JP (2000 - 2004)
- Tochigi-ken, JP (2016)
- Tochigi, JP (2019 - 2020)
Company Filing History:
6 out of 21,351 
3 out of 336 Years Active: 1989-2020
Title: Innovations by Inventor Shigeki Kondo in Solder Materials
Introduction: Shigeki Kondo, a prominent inventor based in Tochigi, Japan, has made significant contributions to the field of solder materials through his innovative patents. With a total of three patents to his name, Kondo's work focuses on improving solder technology, particularly for semiconductor applications.
Latest Patents: Kondo's latest patents include several advancements in solder materials. One notable patent describes a solder material that incorporates a spherical core designed to create space between a joint object and another object to be joined. This material features a solder coated layer made predominantly of tin (Sn) and includes up to 2 mass % of silver (Ag). The solder coated layer boasts an average grain diameter of 3 micrometers or less and a spherical diameter ranging from 1 to 230 micrometers, ensuring high performance in solder joints.
Another significant patent pertains to a core material that includes a solder plating layer made of a Sn-Bi-based solder alloy. This invention addresses the distribution of bismuth (Bi) within the solder plating layer, ensuring a homogenous concentration across the entire layer. This innovation is crucial for enhancing the reliability and efficiency of solder joints in semiconductor packages.
Career Highlights: Shigeki Kondo works at Senju Metal Industry Co., Ltd., a leading company in the production of solder materials. His expertise in solder technology is reflected in his innovative approaches that aim to enhance the performance and reliability of soldered connections in various applications.
Collaborations: Throughout his career, Kondo has collaborated with fellow experts in the field, including Hiroyoshi Kawasaki and Takahiro Roppongi. These partnerships have contributed to the development of cutting-edge solder materials that address the ever-evolving needs of the electronics industry.
Conclusion: Shigeki Kondo's contributions to solder material innovations have established him as a noteworthy inventor in the field. His patents reflect a commitment to advancing technology that supports efficient and reliable soldering processes. As the demand for high-performance electronics continues to grow, Kondo's work will undoubtedly play a crucial role in shaping the future of solder materials.