The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Jun. 29, 2016
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/00 (2006.01); B23K 35/22 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); B32B 15/01 (2006.01); H05K 3/34 (2006.01); B23K 1/00 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0244 (2013.01); B23K 1/0016 (2013.01); B23K 35/025 (2013.01); B23K 35/0222 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B32B 15/018 (2013.01); C22C 13/00 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H05K 3/3463 (2013.01); H01L 23/3114 (2013.01); H01L 24/05 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/1312 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/1316 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13105 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13157 (2013.01); H01L 2224/13169 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/2076 (2013.01); H05K 2201/10734 (2013.01);
Abstract
Provided is a process for mounting a BGA (Ball Grid Array) or CSP (Chip Size Package) on a printed circuit board. The process includes melting and fusing together solder paste and a solder ball. The solder ball has a solder composition that includes 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. In the process, the solder ball is placed on an electrode of the BGA or CSP substrate and the solder paste is applied onto an opposing electrode of the printed circuit board.