The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
Jun. 25, 2014
Shunsaku Yoshikawa, Tokyo, JP;
Yoshie Yamanaka, Tokyo, JP;
Tsukasa Ohnishi, Tokyo, JP;
Seiko Ishibashi, Tokyo, JP;
Koji Watanabe, Tokyo, JP;
Hiroki Ishikawa, Tokyo, JP;
Yutaka Chiba, Tokyo, JP;
Shunsaku Yoshikawa, Tokyo, JP;
Yoshie Yamanaka, Tokyo, JP;
Tsukasa Ohnishi, Tokyo, JP;
Seiko Ishibashi, Tokyo, JP;
Koji Watanabe, Tokyo, JP;
Hiroki Ishikawa, Tokyo, JP;
Yutaka Chiba, Tokyo, JP;
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Abstract
A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy contains Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux.