The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2018
Filed:
Aug. 05, 2013
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Tsukasa Ohnishi, Tokyo, JP;
Shunsaku Yoshikawa, Tokyo, JP;
Ken Tachibana, Tokyo, JP;
Yoshie Yamanaka, Tokyo, JP;
Hikaru Nomura, Tokyo, JP;
Kyu-oh Lee, Chandler, AZ (US);
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); B23K 35/26 (2006.01); B23K 1/00 (2006.01); B23K 35/02 (2006.01); C22C 13/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 1/0016 (2013.01); B23K 35/025 (2013.01); B23K 35/0222 (2013.01); B23K 35/0227 (2013.01); B23K 35/0244 (2013.01); B23K 35/26 (2013.01); C22C 13/00 (2013.01); B23K 2201/40 (2013.01); Y10T 403/479 (2015.01);
Abstract
A lead-free solder alloy capable of forming solder joints in which electromigration and an increase in resistance during electric conduction at a high current density are suppressed has an alloy composition consisting essentially of 1.0-13.0 mass % of In, 0.1-4.0 mass % of Ag, 0.3-1.0 mass % of Cu, a remainder of Sn. The solder alloy has excellent tensile properties even at a high temperature exceeding 100° C. and can be used not only for CPUs but also for power semiconductors.