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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9527167 B1

PDFFull Text
Date of Patent:
Dec. 27, 2016

Filed:

Mar. 28, 2012

Lead-free solder ball

Applicants:

Tsukasa Ohnishi, Tokyo, JP;

Yoshie Yamanaka, Tokyo, JP;

Ken Tachibana, Tokyo, JP;

Inventors:

Tsukasa Ohnishi, Tokyo, JP;

Yoshie Yamanaka, Tokyo, JP;

Ken Tachibana, Tokyo, JP;

Assignee:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Attorney:

The Webb Law Firm

Primary Examiner:

Erin Saad

Int. Cl.
CPC ...
B23K 35/00 (2006.01); B23K 35/22 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); B32B 15/01 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0244 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B32B 15/018 (2013.01); C22C 13/00 (2013.01); H01L 24/13 (2013.01); H05K 3/3463 (2013.01); H01L 24/05 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13111 (2013.01); H01L 2924/01322 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A lead-free solder ball for electrodes of a BGA or CSP comprising 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. Even when a printed circuit board to which the solder ball is bonded has Cu electrodes or Au-plated or Au/Pd-plated Ni electrodes, the solder ball has good resistance to drop impacts. The composition may further contain at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003-0.1 mass %.

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Ohnishi, Tsukasa. (2016). Lead-free solder ball (U.S. Patent No. 9527167). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9527167

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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