The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
Jun. 05, 2017
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Masayuki Suzuki, Tokyo, JP;
Naoko Izumita, Tokyo, JP;
Shunsaku Yoshikawa, Tokyo, JP;
Ken Tachibana, Tokyo, JP;
Rei Fujimaki, Tokyo, JP;
Hikaru Nomura, Tokyo, JP;
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/02 (2006.01); C22C 13/00 (2006.01); C22C 13/02 (2006.01); B23K 35/26 (2006.01); H05K 3/34 (2006.01); B23K 35/36 (2006.01);
U.S. Cl.
CPC ...
B23K 35/025 (2013.01); B23K 35/0222 (2013.01); B23K 35/0244 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/36 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H05K 3/3463 (2013.01); H05K 2201/10636 (2013.01); Y02P 70/611 (2015.11); Y10T 403/479 (2015.01);
Abstract
Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn.