Senju Metal Industry Co., Ltd.

Rei Fujimaki

Minoru Ueshima

Takeshi Sakamoto

Shunsaku Yoshikawa

Masayuki A Suzuki

Tsukasa Ohnishi

Ken Tachibana

Hikaru Nomura

Naoko Izumita

Seiko Ishibashi

Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn.

Lead-free solder alloy

Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface, is comprised of a ceramic. The solder alloy has an alloy composition comprising, in terms of mass %, 3-10% of Sb, 0-4% of Ag and 0.3-1.2% of Cu, with the remainder consisting of Sn. Furthermore, the alloy composition may contain, in terms of mass %, a total of 0.15% or less of one or more elements selected from among Ni and Co and/or a total of 0.02% or less of one or more elements selected from among P and Ge.

Solder alloy, and LED module

Solder alloy and module

Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass % of Al are contained, 0.02 to 0.1 mass % of Ti and/or 0.01 to 0.05 mass % of Co may be contained as required and the remainder is made up by Sn.

Sn-Cu-based lead-free solder alloy

Provided is a high-temperature lead-free solder alloy having excellent tensile strength and elongation in a high-temperature environment of 250&#xb0; C. In order to make the structure of an Sn&#x2014;Sb&#x2014;Ag&#x2014;Cu solder alloy finer and cause stress applied to the solder alloy to disperse, at least one material selected from the group consisting of, in mass %, 0.003 to 1.0% of Al, 0.01 to 0.2% of Fe, and 0.005 to 0.4% of Ti is added to a solder alloy containing 35 to 40% of Sb, 8 to 25% of Ag, and 5 to 10% of Cu, with the remainder made up by Sn.

High-temperature lead-free solder alloy

A Sn&#x2014;Sb&#x2014;Ag&#x2014;Cu based high-temperature lead-free solder alloy which has excellent connection reliability and which does not form a low melting point phase even when solidified by slow cooling is provided. It has an alloy composition consisting essentially of, in mass percent, Sb: 35-40%, Ag: 13-18%, Cu: 6-8%, and a remainder of Sn.

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Tokyo, Japan

Rei Fujimaki