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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9227258 B1

PDFFull Text
Date of Patent:
Jan. 05, 2016

Filed:

Apr. 23, 2009

Lead-free solder alloy having reduced shrinkage cavities

Applicants:

Yuji Kawamata, Tokyo, JP;

Minoru Ueshima, Tokyo, JP;

Min Kang, Gyeonggi-do, KR;

Kayako Nakagawa, Kobe, JP;

Yasuaki Kokubu, Kurume, JP;

Inventors:

Yuji Kawamata, Tokyo, JP;

Minoru Ueshima, Tokyo, JP;

Min Kang, Gyeonggi-do, KR;

Kayako Nakagawa, Kobe, JP;

Yasuaki Kokubu, Kurume, JP;

Assignee:

SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;

Attorney:

Michael Tobias

Primary Examiner:

Devang R Patel

Int. Cl.
CPC ...
B23K 35/22 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); B23K 35/362 (2006.01); C22C 13/02 (2006.01); H01L 23/488 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0016 (2013.01); B23K 1/203 (2013.01); B23K 35/0244 (2013.01); B23K 35/262 (2013.01); B23K 35/362 (2013.01); C22C 13/02 (2013.01); H01L 23/488 (2013.01); H05K 3/3484 (2013.01); B23K 2201/42 (2013.01); H01L 23/49816 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A lead-free solder alloy having improved surface properties which suppresses minute irregularities and shrinkage cavities has a composition consisting essentially of Ag: 0.1-1.5%, Bi: 2.5-5.0%, Cu: 0.5-1.0%, optionally Ni: 0.015-0.035% and/or at least one of Ge and Ga: 0.0005-0.01%, and a remainder of Sn and unavoidable impurities.

Find Patent Forward Citations

Kawamata, Yuji. (2016). Lead-free solder alloy having reduced shrinkage cavities (U.S. Patent No. 9227258). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9227258

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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