Company Filing History:
Years Active: 2016
Title: Kayako Nakagawa: Innovator in Lead-Free Solder Alloy Technology
Introduction
Kayako Nakagawa is a prominent inventor based in Kobe, Japan. He is known for his significant contributions to the field of materials science, particularly in the development of lead-free solder alloys. His innovative work aims to enhance the performance and safety of solder materials used in various electronic applications.
Latest Patents
One of Nakagawa's notable patents is for a lead-free solder alloy that has reduced shrinkage cavities. This alloy features a composition that includes Ag: 0.1-1.5%, Bi: 2.5-5.0%, Cu: 0.5-1.0%, and optionally Ni: 0.015-0.035% along with at least one of Ge and Ga: 0.0005-0.01%, with the remainder being Sn and unavoidable impurities. This invention addresses the common issues of surface irregularities and shrinkage cavities, making it a valuable advancement in solder technology.
Career Highlights
Kayako Nakagawa has made significant strides in his career, particularly through his work at Senju Metal Industry Co., Ltd. His expertise in solder materials has positioned him as a key figure in the industry, contributing to the development of safer and more efficient electronic components.
Collaborations
Throughout his career, Nakagawa has collaborated with notable colleagues such as Yuji Kawamata and Minoru Ueshima. These partnerships have fostered innovation and have been instrumental in advancing the research and development of solder materials.
Conclusion
Kayako Nakagawa's contributions to lead-free solder alloy technology exemplify his commitment to innovation in materials science. His work not only enhances the performance of electronic components but also promotes environmental safety. His achievements continue to influence the industry positively.