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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10090268 B1

PDFFull Text
Date of Patent:
Oct. 02, 2018

Filed:

Jul. 27, 2015

Method of forming solder bump, and solder bump

Applicants:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Senju Metal Industry Co., Ltd., Adachi-ku, Tokyo, JP;

Inventors:

Yasuyuki Sekimoto, Nagaokakyo, JP;

Hidekiyo Takaoka, Nagaokakyo, JP;

Shigeo Nishimura, Nagaokakyo, JP;

Minoru Ueshima, Matsudo, JP;

Tohru Kurushima, Tokyo, JP;

Assignees:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

SENJU METAL INDUSTRY CO., LTD., Adachi-Ku, Tokyo, JP;

Attorney:

Arent Fox LLP

Primary Examiner:

C Melissa Koslow

Int. Cl.
CPC ...
H01L 21/58 (2006.01); H01L 23/00 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); C22C 12/00 (2006.01); H05K 3/34 (2006.01); B23K 35/30 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); B23K 35/0244 (2013.01); B23K 35/0261 (2013.01); B23K 35/264 (2013.01); B23K 35/3033 (2013.01); C22C 12/00 (2013.01); H01L 21/48 (2013.01); H01L 21/50 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H05K 3/3436 (2013.01); H05K 3/3463 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05005 (2013.01); H01L 2224/05023 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/08503 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/16013 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/16503 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/8191 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/83855 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/3841 (2013.01); H05K 2201/10674 (2013.01); Y02P 70/613 (2015.11);
Abstract

A solder bump formed on an Ni electrode with the use of a solder ball containing Bi as a main component and Sn as a sub component. The solder ball contains Sn from 1.0 to 10.0 mass % and at most 1.0 mass % of at least one of Cu and Ag. A solder joint portion obtained by use of the solder bump has at least one of Sn and an SnBi eutectic alloy.

Find Patent Forward Citations

Sekimoto, Yasuyuki. (2018). Method of forming solder bump, and solder bump (U.S. Patent No. 10090268). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10090268

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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