Shigeo Nishimura

Title: Shigeo Nishimura: Innovator in Solder Technology

Introduction

Shigeo Nishimura is a notable inventor based in Nagaokakyo, Japan. He has made significant contributions to the field of solder technology, holding 2 patents that showcase his innovative approaches to manufacturing and materials.

Latest Patents

Nishimura's latest patents include a "Method of forming solder bump" and "Method for manufacturing substrate having built-in components." The first patent describes a solder bump formed on a nickel electrode using a solder ball that contains bismuth as the main component and tin as a sub-component. This solder ball comprises tin in a range of 1.0 to 10.0 mass percent and at most 1.0 mass percent of at least one of copper and silver. The solder joint portion created with this solder bump includes at least one of tin or an SnBi eutectic alloy. The second patent outlines a method for creating a substrate with built-in components, which prevents short circuits caused by solder or conductive adhesive spread. This method involves forming land regions for circuit component connections and a wetting prevention region on a metal foil's surface to reduce solder wettability.

Career Highlights

Throughout his career, Nishimura has worked with prominent companies such as Murata Manufacturing Co., Ltd. and Senju Metal Industry Co., Ltd. His experience in these organizations has allowed him to refine his expertise in solder technology and contribute to advancements in the field.

Collaborations

Nishimura has collaborated with notable coworkers, including Katsuro Hirayama and Yasuyuki Sekimoto. Their combined efforts have likely fostered innovation and development in their respective projects.

Conclusion

Shigeo Nishimura's contributions to solder technology through his patents and career experiences highlight his role as an influential inventor in the industry. His work continues to impact the field positively.