The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
Jul. 29, 2013
Osaka University, Osaka, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Kozo Fujimoto, Osaka, JP;
Shinji Fukumoto, Osaka, JP;
Michiya Matsushima, Osaka, JP;
Satoshi Watanabe, Saitama-ken, JP;
Takeshi Kan, Saitama-ken, JP;
Minoru Ueshima, Tokyo, JP;
Takeshi Sakamoto, Tokyo, JP;
Shu Inoue, Nara-ken, JP;
OSAKA UNIVERSITY, Osaka, JP;
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Abstract
An method of mounting electronic component includes: providing a connecting layer between a wiring and an electronic component, the connecting layer including a conductive layer formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent and one or two layers of a thermoplastic resin layer formed of thermoplastic resin; and electrically connecting the electronic component to the wiring through the connecting layer.