Location History:
- Kobe-shi, Hyogo JP (2009)
- Osaka, JP (2017)
Company Filing History:
2 out of 338 
1 out of 989 
1 out of 832,961 Years Active: 2009-2017
Title: Kozo Fujimoto: Innovator in Electronic Component Mounting
Introduction
Kozo Fujimoto is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of electronic component mounting, holding a total of 2 patents. His innovative methods have advanced the way electronic components are integrated into circuit boards.
Latest Patents
Fujimoto's latest patents include a method of mounting electronic components to circuit boards. This method involves providing a connecting layer between wiring and an electronic component. The connecting layer consists of a conductive layer made from a solder powder-containing resin composition, which includes thermosetting resin, solder powder, and a reducing agent. Additionally, it features one or two layers of thermoplastic resin, allowing for effective electrical connections.
Another significant patent is related to interconnecting terminals and mounting semiconductor devices. This method ensures excellent electrical connections between opposing electrodes. It involves placing electrode pads of a semiconductor chip and corresponding lands on a substrate with an electrically conductive adhesive in between. The adhesive is heated to a temperature above the melting point of its conductive particles, allowing for bonding before the resin is completely cured.
Career Highlights
Fujimoto has worked with Senju Metal Industry Co., Ltd., where he applied his expertise in electronic component technologies. His work has contributed to advancements in the manufacturing processes of electronic devices.
Collaborations
Throughout his career, Fujimoto has collaborated with notable professionals in the field, including Kiyokazu Yasuda and Jong-Min Kim. These collaborations have further enriched his innovative approaches and methodologies.
Conclusion
Kozo Fujimoto's contributions to electronic component mounting and semiconductor device integration highlight his role as a key innovator in the industry. His patents reflect a commitment to enhancing the efficiency and effectiveness of electronic manufacturing processes.