The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2009
Filed:
Feb. 04, 2004
Kozo Fujimoto, Kobe-shi, Hyogo 657-0051, JP;
Kiyokazu Yasuda, Ibaraki, JP;
Jong-min Kim, Toyonaka, JP;
Kozo Fujimoto, Kobe-shi, Hyogo 657-0051, JP;
Kiyokazu Yasuda, Ibaraki, JP;
Jong-Min Kim, Toyonaka, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Other;
Abstract
A method of interconnecting terminals so as to obtain an excellent electrical connection between terminals such as opposing electrodes and a mounting method for semiconductor devices using this connecting method are provided. Electrode padsof a semiconductor chipand landswhich are provided on a substrateso as to correspond with the electrode padsare placed so as to oppose each other with an electrically conductive adhesive therebetween. Then, the electrically conductive adhesive is heated to a temperature which is higher than the melting point of electrically conductive particles contained in the electrically conductive adhesive and at which a resin is not completely cured, and the electrically conductive particles are bonded to each other. Then, the semiconductor chipand the substrateare secured by completely curing the resin in the electrically conductive adhesive.