The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Aug. 17, 2017
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Tetsu Takemasa, Tokyo, JP;
Minoru Ueshima, Tokyo, JP;
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B22F 7/06 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B22F 7/064 (2013.01); H01L 24/29 (2013.01); H01L 2224/29218 (2013.01); H01L 2224/29224 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29244 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/29255 (2013.01); H01L 2224/29264 (2013.01); H01L 2224/29266 (2013.01); H01L 2224/29269 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/3512 (2013.01);
Abstract
A metal sintered bonding body bonds a substrate and a die. In the metal sintered bonding body, at least a center part and corner part of a rectangular region where the metal sintered bonding body faces the die have a low-porosity region whose porosity is lower than an average porosity of the rectangular region. The low-porosity region is located within a strip-shaped region whose central lines are diagonal lines of the rectangular region.