The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Sep. 03, 2020
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Hans-Jurgen Albrecht, Berlin, DE;
Klaus Wilke, Berlin, DE;
Katsuaki Suganuma, Ibaraki, JP;
Minoru Ueshima, Tokyo, JP;
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); H05K 3/34 (2006.01); B23K 35/02 (2006.01); C22C 13/02 (2006.01); C22C 13/00 (2006.01); C22C 1/02 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/0244 (2013.01); C22C 1/02 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H05K 3/3463 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H05K 1/0263 (2013.01); Y10T 403/479 (2015.01);
Abstract
A solder joint which is used in power devices and the like and which can withstand a high current density without developing electromigration is formed of a Sn—Ag—Bi—In based alloy. The solder joint is formed of a solder alloy consisting essentially of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn. The solder alloy may further contain at least one of Ni, Co, and Fe.