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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10297539 B1

PDFFull Text
Date of Patent:
May. 21, 2019

Filed:

May. 28, 2015

Electronic device including soldered surface-mount component

Applicant:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Inventors:

Minoru Ueshima, Chiba, JP;

Minoru Toyoda, Tochigi, JP;

Assignee:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Attorney:

Chernoff, Vilhauer, McClung & Stenzel, LLP

Primary Examiner:

William F Kraig

Assistant Examiner:

Vicki B Booker

Int. Cl.
CPC ...
H05K 3/34 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49582 (2013.01); H01L 23/3107 (2013.01); H01L 23/4334 (2013.01); H01L 23/49513 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H05K 3/3463 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/08501 (2013.01); H01L 2224/293 (2013.01); H01L 2224/29026 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29447 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32501 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01026 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/0134 (2013.01); H01L 2924/0135 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01083 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01); H05K 3/3421 (2013.01); H05K 2203/047 (2013.01);
Abstract

The melting of die-bonding solder material is prevented even when soldering a surface-mount component formed using the die-bonding solder material on a printed circuit board using a mounting solder material. The surface-mount component formed using (Sn—Sb)-based solder material having high melting point as the solder material for die pad, the (Sn—Sb)-based solder material containing Cu not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn—Ag—Cu—Bi)-based solder material as the mounting solder material with the solder material being applied on the terminal portion. The melting of die-bonding solder material is prevented even at the heating temperature (240 degrees C. or less) of a reflow furnace.

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