The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Jul. 29, 2020
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Yuuki Iijima, Tokyo, JP;
Shunsaku Yoshikawa, Tokyo, JP;
Takashi Saito, Tokyo, JP;
Kanta Dei, Tokyo, JP;
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 13/00 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/0244 (2013.01); C22C 13/00 (2013.01);
Abstract
Provided are a solder alloy and a solder joint which have high tensile strength, can suppress Ni leaching and can suppress generation of voids at a bonded interface. The solder alloy has an alloy composition consisting of, by mass %, —Ag: 1.0 to 4.0%, Cu: 0.1 to 1.0%, Ni: 0.005 to 0.3%, Co: 0.003 to 0.1%, and Ge: 0.001 to 0.015% with the balance being Sn