The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Jul. 21, 2023
Applicant:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Inventors:

Keisuke Shinozaki, Tokyo, JP;

Kazuya Kitazawa, Tokyo, JP;

Hiroaki Kawamata, Tokyo, JP;

Yuki Fujino, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/36 (2006.01); B23K 35/02 (2006.01);
U.S. Cl.
CPC ...
B23K 35/3613 (2013.01); B23K 35/025 (2013.01); B23K 35/3618 (2013.01);
Abstract

This flux contains a first solvent and a thixotropic agent. The first solvent either has a viscosity of 10 Pa·s or more at 30° C. or is a solid at 30° C., has a boiling point of 200° C. or more, and has a weight loss rate of less than 96 mass % when heated to 230° C. The thixotropic agent contains a polyamide that is one or more substances selected from the group consisting of condensates of an aliphatic carboxylic acid and an amine and condensates of an aliphatic carboxylic acid, a hydroxy group-containing aliphatic carboxylic acid, and an amine. The content of the first solvent is 30 mass % or more with respect to the total mass of flux. The content of the polyamide exceeds 2 mass % with respect to the total mass of flux.


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Shinozaki, Keisuke. (2025). Flux, solder paste, and method for producing bonded body (U.S. Patent No. 12330244). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12330244

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