Saitama, Japan

Kazuya Kitazawa

USPTO Granted Patents = 9 


 

Average Co-Inventor Count = 3.9

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Saitama, JP (2018 - 2023)
  • Tokyo, JP (2020 - 2023)
  • Kuki, JP (2023)

Company Filing History:


Years Active: 2018-2025

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9 patents (USPTO):Explore Patents

Title: Kazuya Kitazawa: Innovator in Flux and Solder Paste Technology

Introduction

Kazuya Kitazawa is a prominent inventor based in Saitama, Japan. He has made significant contributions to the field of materials science, particularly in the development of flux and solder paste technologies. With a total of eight patents to his name, Kitazawa's work has had a substantial impact on the electronics industry.

Latest Patents

Among his latest patents, Kitazawa has developed a unique flux that contains a first solvent and a thixotropic agent. This innovative flux is characterized by a first solvent that either has a viscosity of 10 Pa·s or more at 30° C. or is a solid at that temperature. The first solvent also has a boiling point of 200° C. or more and a weight loss rate of less than 96 mass % when heated to 230° C. The thixotropic agent includes a polyamide derived from specific condensates. Additionally, he has created a solder paste that incorporates rosin, an activator, and a solvent, with specific ratios of monoalkylene glycol-based solvents and solid solvents.

Career Highlights

Kazuya Kitazawa is currently employed at Senju Metal Industry Co., Ltd., where he continues to innovate in the field of soldering materials. His work has been instrumental in enhancing the performance and reliability of electronic components.

Collaborations

Kitazawa has collaborated with notable colleagues such as Hiroaki Kawamata and Keisuke Shinozaki, contributing to the advancement of their shared projects and innovations.

Conclusion

Kazuya Kitazawa's contributions to the field of flux and solder paste technology exemplify his dedication to innovation. His patents reflect a deep understanding of materials science and a commitment to improving electronic manufacturing processes.

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