The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Mar. 25, 2021
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Ryuji Ukai, Tokyo, JP;
Kazuya Kitazawa, Tokyo, JP;
Hiroaki Kawamata, Tokyo, JP;
Shinji Kikuchi, Tokyo, JP;
Keisuke Shinozaki, Tokyo, JP;
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/362 (2006.01); B23K 35/02 (2006.01); B23K 35/36 (2006.01);
U.S. Cl.
CPC ...
B23K 35/362 (2013.01); B23K 35/025 (2013.01); B23K 35/3612 (2013.01); B23K 35/3613 (2013.01);
Abstract
A flux for a solder paste includes rosin, an activator and a solvent. The solvent includes a monoalkylene glycol-based solvent and a solid solvent that is solid at 20° C. The total content of the monoalkylene glycol-based solvent and the solid solvent ranges from 40% by mass to 60% by mass with the total amount of the flux as 100%. The content of the solid solvent ranges from 5% by mass to 25% by mass with the total amount of the flux as 100%.