Senju Metal Industry Co., Ltd.

Kazuya Kitazawa

Keisuke Shinozaki

Hiroaki Kawamata

Shinji Kikuchi

Ryuji Ukai

Yuki Fujino

Hideki Nakamura

Takayuki Kobayashi

Hiroyoshi Kawasaki

Yoshinori Takagi

Masato Shiratori

Takashi Nauchi

Sakie Okada

Toshihiko Mutsuji

Tomoko Nagai

Kazuyori Takagi

Nanako Miyagi

Yutaka Hashimoto

Kazuhiro Minegishi

Yusuke Kawano

Akiko Takaki

Kengo Ohta

Yasuyuki Yamagawa

Rina Horikoshi

Masashi Uehata

Hideki Mori

Takafumi Ohtake

Ryuichi Tsuda

Teppei Otsuki

A solder paste includes a solder powder and a flux. The flux includes a rosin, an activator, a solvent, and a thixotropic agent containing a polyethylene glycol. A content of the polyethylene glycol is 10 mass % to 20 mass % with respect to a total mass of the flux, a content of the thixotropic agent excluding the polyethylene glycol is 5 mass % or less with respect to the total mass of the flux, and a content of the rosin is more than 15 mass % and 50 mass % or less with respect to the total mass of the flux.

Solder paste

This flux contains a first solvent and a thixotropic agent. The first solvent either has a viscosity of 10 Pa·s or more at 30° C. or is a solid at 30° C., has a boiling point of 200° C. or more, and has a weight loss rate of less than 96 mass % when heated to 230° C. The thixotropic agent contains a polyamide that is one or more substances selected from the group consisting of condensates of an aliphatic carboxylic acid and an amine and condensates of an aliphatic carboxylic acid, a hydroxy group-containing aliphatic carboxylic acid, and an amine. The content of the first solvent is 30 mass % or more with respect to the total mass of flux. The content of the polyamide exceeds 2 mass % with respect to the total mass of flux.

Flux, solder paste, and method for producing bonded body

A flux for a solder paste includes rosin, an activator and a solvent. The solvent includes a monoalkylene glycol-based solvent and a solid solvent that is solid at 20° C. The total content of the monoalkylene glycol-based solvent and the solid solvent ranges from 40% by mass to 60% by mass with the total amount of the flux as 100%. The content of the solid solvent ranges from 5% by mass to 25% by mass with the total amount of the flux as 100%.

Flux and solder paste

Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt % of a (carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt % of a rosin, and furthermore contains a solvent. The (carboxyalkyl)isocyanurate adduct is a mono(carboxyalkyl)isocyanurate adduct, a bis(carboxyalkyl)isocyanurate adduct, a tris(carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.

A flux for soldering contains 10 to 40 wt % of coumarin, 5 to 30 wt % of a monoamide-based thixotropic agent and 40 to 80 wt % of a solvent. A solder paste contains the flux and a solder powder. A method for producing a soldered product includes supplying the solder paste to a soldering portion of an electronic circuit board, mounting an electronic component onto the soldering portion and heating the soldering portion up to a temperature at which the solder powder melts in a reducing atmosphere containing a reducing gas to join the electronic component and the electronic circuit board.

Flux, solder paste and method for producing soldered product

If a flux contains an amount of thixotropic agent necessary for obtaining the effect of suppressing a heating sagging, the amount of flux residue increases, and, if applied for uses that do not involve washing, a large amount of flux residue derived from the thixotropic agent remains around the soldered portions, thereby affecting chemical and electrical reliability; and that washing performance is poor in uses involving washing of the flux residue. Accordingly, this soldering flux contains nanofibers of one or more kinds from among polysaccharides, modified polysaccharides, and incompletely modified polysaccharides being modified from polysaccharides into modified polysaccharides, by an amount of 50 wt ppm or more and 3000 wt ppm or less with respect to a total amount of flux.

Soldering flux and soldering paste

A defect may occur in which as the amount of fluid discharged by a fluid discharge device decreases, a mask is not filled with the fluid even when the fluid is discharged. In order to fill a workpiece with the fluid, it is necessary to replace air in the workpiece corresponding to a discharge part with the fluid. The air in the workpiece is removed in advance, thereby filling the workpiece with the discharged fluid. A fluid discharge device in which, at one end of a discharge head, a suction port for sucking air in the mask on the workpiece, and a fluid discharge device having a discharge nozzle formed thereon for discharging the fluid are formed is used.

Fluid discharge device, fluid discharge method, and fluid application device

A purpose of the present invention is to provide a flux having an improved cleaning property by suppressing a carbonization of a flux residue. A flux contains an organic acid, a thixotropic agent, rosin and a solvent wherein a fatty acid monoalkylol amide having 14-20 carbon atoms is contained as the thixotropic agent. The fatty acid monoethanol amide is added in an amount of 3-10% by weight as the thixotropic agent. In addition, a dicarboxylic acid having 10 or less carbon atoms is added in an amount of 4-10% by weight as the organic acid. Moreover, the solvent is added in an amount of 30-60% by weight.

Flux, solder paste and solder joint

Provided is a flux which can remove metal oxides to improve solder wettability and can fix the object to be soldered with flux residue. The flux contains thermosetting resin, and long-chain dibasic acid mixture including one or more species of first long-chain dibasic acid having an alkyl group in a side chain, the first long-chain dibasic acid being added as a hardening agent for hardening the thermosetting resin and an activator, and second long-chain dibasic acid having an alkyl group and an alkoxycarbonyl group in a side chain and having carbon number of 8 or more in a main chain between the carboxyl groups at opposite terminals. It is preferable that content of the thermosetting resin is 30% through 70% and content of the long-chain dibasic acid mixture is 20% through 60%.

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Saitama, Japan

Kazuya Kitazawa