The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Jan. 16, 2019
Senju Metal Industry Co., Ltd., Tokyo, JP;
Yutaka Hashimoto, Soka, JP;
Kazuyori Takagi, Inzai, JP;
Tomoko Nagai, Yashio, JP;
Nanako Miyagi, Nagareyama, JP;
Kazuya Kitazawa, Kuki, JP;
Akiko Takaki, Koshigaya, JP;
Kazuhiro Minegishi, Koshigaya, JP;
Teppei Otsuki, Soka, JP;
Rina Horikoshi, Tokyo, JP;
Ryuichi Tsuda, Tokyo, JP;
Hiroyoshi Kawasaki, Tokyo, JP;
Masato Shiratori, Shimotsuke, JP;
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Abstract
Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt % of a (carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt % of a rosin, and furthermore contains a solvent. The (carboxyalkyl)isocyanurate adduct is a mono(carboxyalkyl)isocyanurate adduct, a bis(carboxyalkyl)isocyanurate adduct, a tris(carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.