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For the Inventor, By the Inventor

Tokyo, Japan

Tsutomu Hiyama

This inventor holds 15 USPTO granted patents and 3 published patent applications and 10 EPO patents. Top assignee: Senju Metal Industry Co., Ltd.. Active years: 2011-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsutomu Hiyama. Retrieved from https://idiyas.com/inventor/tsutomu-hiyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15 

% Patents Active = 100.0

 

Average Co-Inventor Count = 1.7

ph-index = 3

Forward Citations = 26(Granted Patents)


Location History:

  • Katsusika-ku, JP (2011)
  • Tokyo, JP (2011 - 2023)

Company Filing History:

goldMedal15 out of 338 
 
Senju Metal Industry Co., Ltd.
 patents

Years Active: 2011-2025

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15 patents (USPTO):Explore Patents
1. 12409409 - Condensation device, flux recovery device, soldering device, water vapor removing method, flux recovery method and solder processing method (2025-09-09),
2. 11819952 - Soldering apparatus and method of detecting failures of gasket (2023-11-21),
3. 11235407 - Soldering apparatus and method of fixing gasket to the soldering apparatus (2022-02-01),
4. 11007591 - Reflow soldering apparatus having independently openable main bodies (2021-05-18),
5. 10792607 - Flux recovery device, soldering device and method for removing flux (2020-10-06),
6. 10293439 - Soldering apparatus and flux-applying device (2019-05-21),
7. 10252364 - Soldering apparatus and vacuum-soldering method (2019-04-09),
8. 10076041 - Soldering device (2018-09-11),
9. 9744613 - Flux recovery device and soldering device (2017-08-29),
10. 9744612 - Flux recovery device and soldering device (2017-08-29),
11. 9676048 - Vacuum soldering apparatus and control method therefor (2017-06-13),
12. 9511379 - Gas-intake-port array structure and soldering apparatus (2016-12-06),
13. 9485872 - Gas-blowing-hole array structure and soldering apparatus (2016-11-01),
14. 7988031 - Reflow furnace and heater for blowing hot air (2011-08-02),
15. 7914595 - Fume removal method for a reflow furnace and a reflow furnace (2011-03-29),

Title: Biography of Tsutomu Hiyama

Introduction

Tsutomu Hiyama is a prominent inventor based in Tokyo, Japan, known for his significant contributions to the field of engineering and technology. With a total of 15 patents to his name, Hiyama has developed innovative solutions that enhance various industrial processes.

Latest Patents

Among his latest inventions are a condensation device, flux recovery device, soldering device, water vapor removing method, flux recovery method, and solder processing method. His condensation device is particularly noteworthy, as it effectively removes water vapor from larger amounts of gas without increasing the size compared to related technologies. This device features an outer cooling unit with one or more inner tubes and an outer tube, facilitating efficient cooling and gas processing.

Career Highlights

Hiyama is currently employed at Senju Metal Industry Co., Ltd., where he applies his expertise to develop advanced manufacturing technologies. His work has significantly impacted the efficiency and effectiveness of soldering processes in the industry.

Collaborations

Throughout his career, Hiyama has collaborated with notable colleagues, including Hideki Nakamura and Tomotake Kagaya. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Tsutomu Hiyama's contributions to the field of engineering and technology through his patents and collaborative efforts have established him as a key

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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