The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Feb. 12, 2020
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventor:
Tsutomu Hiyama, Tokyo, JP;
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/08 (2006.01); F16B 19/10 (2006.01);
U.S. Cl.
CPC ...
B23K 3/08 (2013.01); F16B 19/109 (2013.01);
Abstract
Provided are a soldering apparatus that allows a gasket to be easily attached to and detached from the soldering apparatus, and a method of fixing the gasket to the soldering apparatus. The soldering apparatus includes: a furnace body; a gasket that is provided to at least a part of the furnace body, and that seals the furnace body; and a push rivet that fixes the gasket in an attachable/detachable manner to the furnace body.
Hiyama, Tsutomu. (2022). Soldering apparatus and method of fixing gasket to the soldering apparatus (U.S. Patent No. 11235407). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11235407
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile