The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
May. 24, 2021
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Tsutomu Hiyama, Tokyo, JP;
Nobuhiro Kojima, Tokyo, JP;
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/08 (2006.01); B23K 3/04 (2006.01); G01M 3/30 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 3/08 (2013.01); B23K 3/04 (2013.01); G01M 3/30 (2013.01); B23K 2101/42 (2018.08);
Abstract
Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.